What is Low Temperature Conductive Silver Glue?

Low-temperature conductive silver glue, as a special conductive material, contains fine silver particles to act as a conductive medium, and has the property of curing at lower temperatures. These electrically conductive adhesives are particularly suitable for applications where a conductive path needs to be constructed on materials with poor temperature resistance. Due to its excellent conductivity and bond strength at lower temperatures than conventional soldering, low-temperature conductive silver adhesives have shown a wide range of applications in the assembly of electronic components, semiconductor packaging, and the production of printed circuit boards (PCBs).

Key features:

• Compared with high-temperature soldering technology, the curing temperature of low-temperature conductive silver adhesive is usually between 100°C and 150°C, and some products can even be cured at room temperature. This property makes the low-temperature conductive silver adhesive particularly suitable for the soldering of temperature-sensitive components and substrates.
• Excellent conductivitySilver is known for its excellent electrical conductivity, so conductive adhesives infused with silver particles exhibit excellent electrical conductivity.
• Good adhesion: In addition to ensuring a smooth electrical connection, the low-temperature conductive silver adhesive also provides a stable mechanical bond between different materials.
• Adaptable to a wide range of substrates, including glass, ceramic, plastic, and metal.

Fields of application

• Electronics assembly is suitable for surface mount technology (SMT), especially in specific scenarios where high-temperature soldering processes are not suitable.
• Semiconductor packaging: It helps to achieve a stable electrical connection between the chip and the package, and effectively avoids the damage that high temperature may cause to the chip.
• Flexible electronics: Advocating for the construction of circuits on flexible substrates will greatly promote the development and production of bendable or foldable electronic products.
• Cryogenic processing plays a key role in the manufacture of electronic devices with special biocompatibility requirements, helping to ensure the safety of biosensors and other vulnerable components.
• Low-temperature curing conductive silver adhesives, typically at temperatures below 150°C, are electrically conductive adhesives that cure at lower temperatures. The product consists mainly of a silver filler, a resin matrix, and several additives. Its clever combination of excellent electrical conductivity and excellent bonding properties has led to a wide range of applications in a wide range of applications, including electronic packaging, flexible circuits, and sensors. Here is an overview of the key features of the product and its application areas:
• Main ingredients:
• Silver fillers: Electrically conductive materials, such as silver powder or silver sheets, are introduced to build conductive pathways.
• Resin matrix: Epoxy, silicone, or polyurethane are often used as materials that provide the required mechanical strength and excellent adhesion properties to structures after curing.
• Additives improve flowability, stability and curing speed.
• Core features
• Low-temperature curing is suitable for substrates that are not resistant to high temperatures (e.g. plastics, flexible circuit boards) and can be cured in a temperature range of 80°C to 150°C.
• High electrical conductivity: Its volume resistivity ranges from 10⁻⁴ to 10⁻⁵ Ω·cm, which is close to the conductivity of metals.
• Flexibility: Many formulations are suitable for use in situations where bending can be bent or used in dynamic stress environments, e.g., in flexible electronics.
• Process-friendly and precise coating can be achieved through dispensing and printing.
• Typical Applications
• Electronic packaging chip bonding, LED mounting, RF component positioning.
• Flexible Electronics: Focus on the repair technology of printed circuit boards (FPCs) and wearable device leads.
• Preparation of solar cell grid electrodes in the photovoltaic field.
• Sensor/display touch electrodes, shielding material.
• Advantages and limitations
• Advantages: In order to avoid the stress problem caused by high temperature and ensure compatibility with a variety of substrates, this process flow is designed to be simple, especially suitable for the field of precision manufacturing.
• The cost of limitation is relatively high, mainly due to its silver-containing content; In addition, its long-term stability may also be affected by changes in ambient humidity.
• Select considerations
• Conductive requirements need to be evaluated for specific application scenarios, including factors such as resistivity, curing conditions, mechanical strength, and cost. In the case of medical devices, for example, they may need to be biocompatible; For automotive electronics, it is necessary to have the characteristics of high temperature aging.
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With its excellent performance, low-temperature conductive silver adhesive occupies a pivotal position in the field of modern electronics industry, especially in promoting the development of miniaturization, lightweight and high-performance electronic products, playing a vital role.